Laminating plants are used to apply all types of dry film photoresist to the inner and outer layers of printed circuit boards. There are several types of laminators:
Manual laminator.
The lamination process is controlled by the temperature of the shafts, the speed of lamination and the pressure of lamination, and the stability of the set temperature for the laminating rollers is achieved by using thermal controllers and contactless temperature sensors individually for each roller.
Manual laminator with preheating.
It has two preheating shafts at once, which eliminates the process of heating preforms in a drying cabinet before lamination, while all preforms entering the shafts have the same temperature.
Semi-automatic laminator.
It is used for applying all types of dry film photoresist on the inner and outer layers of the PP, thanks to the input conveyor, it automatically loads the PP and is easily accessible for maintenance and adjustment.
Automatic laminator.
It provides the ability to laminate both the inner and outer layers of the PCB, has high productivity, and automatically cuts the photoresist along the given length of the printed circuit board, without requiring operator intervention.
Vacuum laminator.
The semi-automatic device, designed for simultaneous double-sided application of a dry protective solder mask, is distinguished by the ability to achieve excellent film adhesion and ensures the absence of air bubbles using heat, vacuum and pressure during lamination.