Repair station BAS-400

A new system for the safe repair of microcircuits on printed circuit boards such as BGA, QFP, SOIC, etc. BAS-400 provides high precision, repeatable quality of the process. The system is easy to operate and configure, has a friendly interface.


Minimum size 8x8mm
Maximum size 260x200mm
Recommended size 350x200mm
PCB thickness 0.8mm-3mm
Component to be mounted:
Size MAX 55x55mm, MIN 2x2mm
Minimum BGA Ball Size 0.3mm
Accuracy ± 0.01 mm
Heating system:
IR preheat zone 260x220mm (1500 W)
Component top heating Hot air 1200 W
Bottom component heating Hot air 1200 W
Temperature control Type K thermocouples
Station characteristics:
Power Single phase, AC220V 50 / 60Hz
Power consumption 3900W Max.
Dimensions L450xW480xH670mm
Weight 35kg
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