The most popular system for repairing microcircuits on printed circuit boards, such as BGA, QFP, SOIC, etc.
The system includes a touchscreen control screen, 3 individual temperature zones, 6 independent lower preheaters with adjustable height adjustment, upper and lower heating can be programmed, visualization system with the ability to magnify up to 50 times, as well as connect up to 3 thermocouples for monitoring soldering / desoldering process in real time.
|Printed circuit board:|
|The size||MAX 50x50mm, MIN 2x2mm|
|Minimum BGA Ball Size||0.3mm|
|Installation accuracy||± 0.03mm|
|IR preheating zone||380x290mm (2700 W)|
|Top component heating||Hot air 800 W|
|Bottom component heating||Hot air 1200 W|
|Temperature control||Type K thermocouples|
|Food||Single phase, AC220V 50 / 60Hz|
|Power consumption||4800 Wt|